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Evaporator_1, Page 9 of 15 |
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Monday, November 26, 2018, 17:06, Marla Cervantes, UO2/C, 40202-1, TARGET BOAT, Done, UCx Fully loaded graphite insert - UCx26
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Friday, October 11, 2013, 18:10, John Wong, UC2, 39814-IV, LP-IG-LIS, Done, UCx#8 - Final Conditioning
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Wednesday, April 30, 2014, 14:58, John Wong, UC2, 39165-9, LP-SIS, Done, Conditioning UCx#9
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Thursday, May 30, 2013, 16:25, John Wong, UC2, 39165-6, LP-SIS, Done, Conditioning UCx#06
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Wednesday, June 05, 2013, 16:52, Laura Lambert, UC2, 39165-6, LP-SIS, Done, Conditioning UCx#06
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Thursday, June 06, 2013, 16:56, John Wong, UC2, 39165-6, LP-SIS, Done, Conditioning UCx#06
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Friday, August 24, 2012, 16:44, John Wong, UC2, 39165-5, LP-SIS, In progress, Conditioning UCx#5
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Monday, September 03, 2012, 02:56, Peter Kunz , UC2, 39165-5, LP-SIS, In progress, Conditioning UCx05
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Tuesday, September 04, 2012, 17:26, Peter Kunz , UC2, 39165-5, LP-SIS, In progress, Conditioning UCx05
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Friday, September 07, 2012, 17:21, Peter Kunz , UC2, 39165-5, LP-SIS, In progress, Conditioning UCx05
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Monday, September 10, 2012, 11:00, Peter Kunz , UC2, 39165-5, LP-SIS, In progress, Conditioning UCx05
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Friday, June 13, 2014, 15:21, John Wong, UC2, 39165-10, LP-SIS, Done, Conditioning UCx#10
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Thursday, April 05, 2012, 16:47, John Wong, Empty, 38817-3, HP-SIS, Done, Coating target oven /w TaC & sintering
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Tuesday, May 08, 2012, 07:42, John Wong, SiC, 38817-3, HP-SIS, Done, Sintering SiC
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Tuesday, May 10, 2011, 14:58, John Wong, Empty, 38817-2, HP-SIS, Done, Diffusion bonding of Ta Fins for HP-SIS (w.o#38817-2)
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Monday, May 09, 2011, 16:10, John Wong, Empty, 38817-1, HP-SIS, Done, Diffusion bonding of Ta Fins
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Thursday, September 22, 2011, 20:34, John Wong, Empty, 38634-9, LP-SIS, Done, Sintering TaC coating for UCx#2 (spare)
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Tuesday, July 10, 2012, 12:54, John Wong, UC2, 38634-9, LP-SIS, Done, UCx#4 final conditioning completed
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Wednesday, August 03, 2011, 17:16, John Wong, Empty, 38634-8, LP-SIS, Done, Sintering TaC coating
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Thursday, August 04, 2011, 17:46, John Wong, UC2, 38634-8, LP-SIS, Problems resolved, Repacking UCx in new target oven
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