 Wednesday, March 28, 2018, 11:46, Laura Lambert, UO2/C, 40282-2, TARGET BOAT, In progress, Carbonizing first full length 1step UCx target
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Wednesday, March 28, 2018, 11:35
D-shaped discs were cut from cast 2, the same as the last sample of 1stepUCx [see elog i.d. 197]
A 13mm punch was used to punch out discs from pre-cut strips using the old method. |
 Monday, April 09, 2018, 16:51, Laura Lambert, UO2/C, 40282-2, TARGET BOAT, Problems, Carbonizing first full length 1step UCx target 
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Laura Lambert wrote:
Wednesday, March 28, 2018, 11:35 |
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Monday, April 09, 2018, 16:53, Laura Lambert, UO2/C, 40282-2, TARGET BOAT, Problems resolved, Carbonizing first full length 1step UCx target
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Laura Lambert wrote:
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Tuesday, April 10, 2018, 14:49, Laura Lambert, UO2/C, 40282-2, TARGET BOAT, Done, Carbonizing first full length 1step UCx target
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Laura Lambert wrote:
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Tuesday, April 17, 2018, 12:45, Laura Lambert, UO2/C, 40282-2, TARGET BOAT, Done, Processing UC2Flk_20
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Tuesday, April 17, 2018, 10:30
UO2/C green was prepared April 12th, 2018
The cast peeled off the glass nicely April 13th, 2018 |
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Wednesday, March 23, 2011, 18:23, John Wong, , , , , Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4)
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March 23, 2011
12:30: Target oven is wrapped with 3 Ta-heat shields. Pumping down evaporator
18:24: IEVAPIG1 is reading at 4.55e-6 Torr. The p/s will be turned on tomorrow since there is no ISAC Ops on site. |
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Friday, March 25, 2011, 17:22, John Wong, , , , , Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4)
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John Wong wrote:
March 23, 2011 |
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Monday, March 28, 2011, 12:29, John Wong, Empty, 38481-8, HP-FEBIAD, Done, Fins diffusion bonding
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March 28, 2011
12:28: Target oven is wrapped with 3 Ta-heat shields. Pumping down evaporator
March 29, |
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Tuesday, April 05, 2011, 10:37, John Wong, Empty, 38481-6, HP-FEBIAD, Done, Fins diffusion bonding
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Tue Apr 5 10:36:53 2011: Target oven is wrapped with 3 Ta-heat shields. The evaporator is in the process of pumping down.
Tue Apr 5 14:54:00 2011: Evap has been pumped down for over 4 hours. Vac is currently at 5.5e-6 Torr. (See Attachment#1)
Tue Apr 5 15:16:31 2011: TGHT is turned on. Set @ 20A/0.102V; panel reads 18A. Vac @ 4.62e-6 Torr. |
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Wednesday, April 06, 2011, 17:07, John Wong, Empty, 37978-1, HP-FEBIAD, Done, Fins diffusion bonding
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Wed Apr 6 17:06:56 2011: Target oven is wrapped with 3 Ta-heat shields. Pumping down evaporator in progress.
Thu Apr 7 09:32:36 2011: Evaporator has been pumped down for over 16 hrs, vac @ 1.74e-6 Torr (see attachment#1). Target heater
is turned on and about to ramp up. |
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Friday, April 08, 2011, 14:55, John Wong, Empty, 38295-8, HP-FEBIAD, Done, Fins diffusion bonding
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Fri Apr 8 14:51:37 2011: Target is wrapped with 3 Ta-heat shields. The evaporator has been pumped down for over 4 hrs, currently vac @ 2.8e-6
Torr. (See attachment #1, note: the drops in the IG1 reading were due to Controls group helping to fix the alarm handler notifications
for the pagers.) |
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Monday, April 11, 2011, 10:22, John Wong, Empty, 38295-9, HP-FEBIAD, Done, Fins diffusion bonding
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Mon Apr 11 10:21:56 2011: Target is wrapped with 3 Ta-heat shields. Evaporator is pumping down.
Mon Apr 11 14:34:32 2011: Evaporator has been pumped down for over 4 hours. Vac @ 2.83e-6 Torr. (see attachment#1 for pumping
down process). |
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Tuesday, April 12, 2011, 10:30, John Wong, Empty, 38481-5, HP-FEBIAD, Done, Fins diffusion bonding
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Tue Apr 12 10:29:38 2011: Target wrapped with 3 Ta-heat shields. Evaporator is currently being pumped down.
Tue Apr 12 15:03:55 2011: Evaporator has been pumped down for over 4 hrs. Set TGHT @ 20A/ 0.066V, Vac @ 2.46e-6 Torr. (See Attachment#1
pumping down process). |
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Wednesday, April 13, 2011, 10:37, John Wong, Empty, 38481-7, HP-FEBIAD, Done, Diffusion bonding of Ta Fins for FEBIAD-HP
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Wed Apr 13 10:37:25 2011: Target is wrapped with 3 Ta-heat shields. Evaporator is currently being pumped down.
Wed Apr 13 15:28:02 2011: Evaporator has been pumped down for over 5 hrs. Vac @ 2.38e-6 Torr. (See attachment1: Pumping process)
Wed Apr 13 15:29:21 2011: Set TGHT @ 20A/0.074V, Vac 2.98e-6 Torr. |
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Thursday, April 14, 2011, 09:53, John Wong, Empty, 37810-1, HP-FEBIAD, Done, Fins Diffusion bonding
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Thu Apr 14 09:52:59 2011: Target is wrapped with 3-Ta heat shield and ready to go into the evaporator.
Thu Apr 14 11:57:29 2011: The process is on hold until the problem with the screw and the washer of the evaporator is resolved. See
ID#15 for more details. |
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Thursday, April 14, 2011, 17:03, John Wong, Empty, 38481-7, HP-FEBIAD, Problems resolved, Evap. bolt/washer problems & solutions 6x
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Thu Apr 14 14:03:17 2011: What did we see after the fin diffusion bonding of Ta fins for FEBIAD-HP (w.o#38481-7) ? :
1. A problem occurred during the FEBIAD HP Ta fin diffusion bonding and was discovered after the evaporator chamber was opened.
The washer was "wielded" on to the left leg of the target (see attachment #1: washer on target leg). |
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Monday, April 18, 2011, 18:14, John Wong, Empty, 38295-8, HP-FEBIAD, Problems, Sintering target oven coated with TaC
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Mon Apr 18 18:10:53 2011:
FEBIAD-HP target (w.o 38295-8) is coated with TaC (previously prepared on Feb 15, 2011). This target will be used for the SiC run in Oct,
2011. The target is wrapped with 3 Ta-heat shields and is in the evaporator. Pumping down of the evaporator is in process, currently vac @ |
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Wednesday, April 20, 2011, 16:42, John Wong, Empty, 38481-8, HP-FEBIAD, Done, Sintering target oven coated with TaC
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Wed Apr 20 16:39:46 2011: Target oven was coated with TaC early today. The target was allowed to dry and then wrapped with 3 Ta heat-shields.
The target is in the evaporator and it is being pumped down. Vac is currently at 9.48e-6 Torr.
Wed Apr 20 17:51:12 2011 : TGHT @ 60A/0.225V, Vac @ 5.98e-6 Torr. |
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Monday, May 09, 2011, 16:10, John Wong, Empty, 38817-1, HP-SIS, Done, Diffusion bonding of Ta Fins
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Mon May 9 16:09:35 2011: Target is wrapped with 3 Ta heatshields and the evaporator is begin pumped down.
Mon May 9 17:59:57 2011: Vac is @ 1.33e-5 Torr. TGHT was stepped up to 60A before starting the auto heating process (See Attachment#1:
TGHT_ramping_up). Note: Although the vacuum is at low e-5 torr, this should be fine to start the TGHT because it takes a while to heat up |
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Tuesday, May 10, 2011, 14:58, John Wong, Empty, 38817-2, HP-SIS, Done, Diffusion bonding of Ta Fins for HP-SIS (w.o#38817-2)
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Tue May 10 14:56:05 2011: Target is wrapped with 3 heat-shields. The evaporator is pumping down, vac @ 4.72e-6 Torr. TGHT was raised
to 60A/0.239V. Auto heating will being now; THGT will be ramped up to 820A @ 2A/min. (See Attachment#1: Staring_process)
Wed May 11 10:16:03 2011: Auto cooling was started by ISAC Ops' help. TGHT has ramped down to zero. The p/s will be turned off and |
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