| ID |
Date |
Author |
Target Material |
Target Oven W.O# |
Source |
Status |
Subject |
Text |
 |
|
131
|
Monday, May 16, 2016, 15:52 |
Laura Lambert | | | | | Full clean of EVAP1 | Monday, May 16, 2016, 15:51
full clean of inside evap1 this afternoon.
|
|
|
4
|
Monday, March 28, 2011, 12:29 |
John Wong | Empty | 38481-8 | HP-FEBIAD | Done | Fins diffusion bonding | March 28, 2011
12:28: Target oven is wrapped
with 3 Ta-heat shields. Pumping down |
|
|
7
|
Tuesday, April 05, 2011, 10:37 |
John Wong | Empty | 38481-6 | HP-FEBIAD | Done | Fins diffusion bonding | Tue Apr 5 10:36:53 2011: Target
oven is wrapped with 3 Ta-heat shields.
The evaporator is in the process of pumping |
|
|
8
|
Wednesday, April 06, 2011, 17:07 |
John Wong | Empty | 37978-1 | HP-FEBIAD | Done | Fins diffusion bonding | Wed Apr 6 17:06:56 2011: Target oven is
wrapped with 3 Ta-heat shields. Pumping
down evaporator in progress. |
|
|
9
|
Friday, April 08, 2011, 14:55 |
John Wong | Empty | 38295-8 | HP-FEBIAD | Done | Fins diffusion bonding | Fri Apr 8 14:51:37 2011: Target
is wrapped with 3 Ta-heat shields.
The evaporator has been pumped down for over |
|
|
10
|
Monday, April 11, 2011, 10:22 |
John Wong | Empty | 38295-9 | HP-FEBIAD | Done | Fins diffusion bonding | Mon Apr 11 10:21:56 2011: Target is wrapped
with 3 Ta-heat shields. Evaporator
is pumping down. |
|
|
11
|
Tuesday, April 12, 2011, 10:30 |
John Wong | Empty | 38481-5 | HP-FEBIAD | Done | Fins diffusion bonding | Tue Apr 12 10:29:38 2011: Target
wrapped with 3 Ta-heat shields. Evaporator
is currently being pumped down. |
|
|
13
|
Thursday, April 14, 2011, 09:53 |
John Wong | Empty | 37810-1 | HP-FEBIAD | Done | Fins Diffusion bonding | Thu Apr 14 09:52:59 2011: Target is wrapped
with 3-Ta heat shield and ready to go into
the evaporator. |
|
|
250
|
Tuesday, November 05, 2019, 14:50 |
Aaron Schmidt | | | | Maintenance | Fallen Bolt. | One of the TBHT bolts fell out of reach |
|
|
21
|
Tuesday, May 17, 2011, 16:43 |
John Wong | | | | Maintenance | Evaporator Ion gauge replaced | The evaporator ion gauge filament burnt
out on May 11, 2011. A target was in
the evaporator at that time and was about |
|
|
15
|
Thursday, April 14, 2011, 17:03 |
John Wong | Empty | 38481-7 | HP-FEBIAD | Problems resolved | Evap. bolt/washer problems & solutions | Thu Apr 14 14:03:17 2011:
What did we see after the fin diffusion bonding
of Ta fins for FEBIAD-HP (w.o#38481-7) |
6x |
|
233
|
Thursday, March 21, 2019, 09:03 |
Aaron Schmidt | | | | In progress | Evap 1 pump down issue | On Tuesday it was noted that evaporator
1 was not pumping down properly. It was vented
and the seal & seal face wiped with a |
|
|
19
|
Tuesday, May 10, 2011, 14:58 |
John Wong | Empty | 38817-2 | HP-SIS | Done | Diffusion bonding of Ta Fins for HP-SIS (w.o#38817-2) | Tue May 10 14:56:05 2011: Target
is wrapped with 3 heat-shields. The
evaporator is pumping down, vac @ 4.72e-6 |
|
|
12
|
Wednesday, April 13, 2011, 10:37 |
John Wong | Empty | 38481-7 | HP-FEBIAD | Done | Diffusion bonding of Ta Fins for FEBIAD-HP | Wed Apr 13 10:37:25 2011: Target
is wrapped with 3 Ta-heat shields.
Evaporator is currently being pumped down. |
|
|
18
|
Monday, May 09, 2011, 16:10 |
John Wong | Empty | 38817-1 | HP-SIS | Done | Diffusion bonding of Ta Fins | Mon May 9 16:09:35 2011: Target
is wrapped with 3 Ta heatshields and the
evaporator is begin pumped down. |
|
|
1
|
Wednesday, March 23, 2011, 18:23 |
John Wong | | | | | Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4) | March 23, 2011
12:30: Target oven is wrapped with
3 Ta-heat shields. Pumping down evaporator |
|
|
2
|
Friday, March 25, 2011, 17:22 |
John Wong | | | | | Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4) |
|
|
|
3
|
Monday, March 28, 2011, 11:20 |
| | | HP-FEBIAD | Done | Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4) |
|
|
|
84
|
Monday, December 02, 2013, 16:10 |
Anders Mjos | | | | Done | Copper bar on TGHT | The conductivity of the TGHT circuit will
be measured with a copper bar shunt.
Monday, December 02, 2013, 16:00: |
|
|
58
|
Monday, September 03, 2012, 02:56 |
Peter Kunz | UC2 | 39165-5 | LP-SIS | In progress | Conditioning UCx05 | Organic/volatile burnoff complete at TGHT
= 190A. Rampdown initiated. |
|