 Monday, May 16, 2016, 15:52, Laura Lambert, , , , , Full clean of EVAP1
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Monday, May 16, 2016, 15:51
full clean of inside evap1 this afternoon.
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Monday, March 28, 2011, 12:29, John Wong, Empty, 38481-8, HP-FEBIAD, Done, Fins diffusion bonding 
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March 28, 2011
12:28: Target oven is wrapped with 3 Ta-heat shields. Pumping down evaporator
March 29, |
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Tuesday, April 05, 2011, 10:37, John Wong, Empty, 38481-6, HP-FEBIAD, Done, Fins diffusion bonding
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Tue Apr 5 10:36:53 2011: Target oven is wrapped with 3 Ta-heat shields. The evaporator is in the process of pumping down.
Tue Apr 5 14:54:00 2011: Evap has been pumped down for over 4 hours. Vac is currently at 5.5e-6 Torr. (See Attachment#1)
Tue Apr 5 15:16:31 2011: TGHT is turned on. Set @ 20A/0.102V; panel reads 18A. Vac @ 4.62e-6 Torr. |
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Wednesday, April 06, 2011, 17:07, John Wong, Empty, 37978-1, HP-FEBIAD, Done, Fins diffusion bonding
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Wed Apr 6 17:06:56 2011: Target oven is wrapped with 3 Ta-heat shields. Pumping down evaporator in progress.
Thu Apr 7 09:32:36 2011: Evaporator has been pumped down for over 16 hrs, vac @ 1.74e-6 Torr (see attachment#1). Target heater
is turned on and about to ramp up. |
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Friday, April 08, 2011, 14:55, John Wong, Empty, 38295-8, HP-FEBIAD, Done, Fins diffusion bonding
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Fri Apr 8 14:51:37 2011: Target is wrapped with 3 Ta-heat shields. The evaporator has been pumped down for over 4 hrs, currently vac @ 2.8e-6
Torr. (See attachment #1, note: the drops in the IG1 reading were due to Controls group helping to fix the alarm handler notifications
for the pagers.) |
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Monday, April 11, 2011, 10:22, John Wong, Empty, 38295-9, HP-FEBIAD, Done, Fins diffusion bonding
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Mon Apr 11 10:21:56 2011: Target is wrapped with 3 Ta-heat shields. Evaporator is pumping down.
Mon Apr 11 14:34:32 2011: Evaporator has been pumped down for over 4 hours. Vac @ 2.83e-6 Torr. (see attachment#1 for pumping
down process). |
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Tuesday, April 12, 2011, 10:30, John Wong, Empty, 38481-5, HP-FEBIAD, Done, Fins diffusion bonding
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Tue Apr 12 10:29:38 2011: Target wrapped with 3 Ta-heat shields. Evaporator is currently being pumped down.
Tue Apr 12 15:03:55 2011: Evaporator has been pumped down for over 4 hrs. Set TGHT @ 20A/ 0.066V, Vac @ 2.46e-6 Torr. (See Attachment#1
pumping down process). |
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Thursday, April 14, 2011, 09:53, John Wong, Empty, 37810-1, HP-FEBIAD, Done, Fins Diffusion bonding
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Thu Apr 14 09:52:59 2011: Target is wrapped with 3-Ta heat shield and ready to go into the evaporator.
Thu Apr 14 11:57:29 2011: The process is on hold until the problem with the screw and the washer of the evaporator is resolved. See
ID#15 for more details. |
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Tuesday, November 05, 2019, 14:50, Aaron Schmidt, , , , Maintenance, Fallen Bolt.
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One of the TBHT bolts fell out of reach and may be sitting
on the isolation valve or TP.
Remove TP as per WP: |
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Tuesday, May 17, 2011, 16:43, John Wong, , , , Maintenance, Evaporator Ion gauge replaced
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The evaporator ion gauge filament burnt out on May 11, 2011. A target was in the evaporator at that time and was about to being the sintering process.
The gauge had two filaments, so vacuum group helped to switch to the second filament. The evaporator was vented on May 17, 2011, and a new ion gauge
with two filaments was installed. The gauge was tested and it's working fine. |
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Thursday, April 14, 2011, 17:03, John Wong, Empty, 38481-7, HP-FEBIAD, Problems resolved, Evap. bolt/washer problems & solutions 6x
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Thu Apr 14 14:03:17 2011: What did we see after the fin diffusion bonding of Ta fins for FEBIAD-HP (w.o#38481-7) ? :
1. A problem occurred during the FEBIAD HP Ta fin diffusion bonding and was discovered after the evaporator chamber was opened.
The washer was "wielded" on to the left leg of the target (see attachment #1: washer on target leg). |
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Thursday, March 21, 2019, 09:03, Aaron Schmidt, , , , In progress, Evap 1 pump down issue
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On Tuesday it was noted that evaporator 1 was not pumping down properly. It was vented and the seal & seal face wiped with a cloth. The initial pump
down rate was faster, however after 48 hrs, it has still not pumped down to appropriate levels.
Thursday, March 21, 2019, 08:59: IV1 closed & TP1 off. |
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Tuesday, May 10, 2011, 14:58, John Wong, Empty, 38817-2, HP-SIS, Done, Diffusion bonding of Ta Fins for HP-SIS (w.o#38817-2)
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Tue May 10 14:56:05 2011: Target is wrapped with 3 heat-shields. The evaporator is pumping down, vac @ 4.72e-6 Torr. TGHT was raised
to 60A/0.239V. Auto heating will being now; THGT will be ramped up to 820A @ 2A/min. (See Attachment#1: Staring_process)
Wed May 11 10:16:03 2011: Auto cooling was started by ISAC Ops' help. TGHT has ramped down to zero. The p/s will be turned off and |
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Wednesday, April 13, 2011, 10:37, John Wong, Empty, 38481-7, HP-FEBIAD, Done, Diffusion bonding of Ta Fins for FEBIAD-HP
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Wed Apr 13 10:37:25 2011: Target is wrapped with 3 Ta-heat shields. Evaporator is currently being pumped down.
Wed Apr 13 15:28:02 2011: Evaporator has been pumped down for over 5 hrs. Vac @ 2.38e-6 Torr. (See attachment1: Pumping process)
Wed Apr 13 15:29:21 2011: Set TGHT @ 20A/0.074V, Vac 2.98e-6 Torr. |
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Monday, May 09, 2011, 16:10, John Wong, Empty, 38817-1, HP-SIS, Done, Diffusion bonding of Ta Fins
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Mon May 9 16:09:35 2011: Target is wrapped with 3 Ta heatshields and the evaporator is begin pumped down.
Mon May 9 17:59:57 2011: Vac is @ 1.33e-5 Torr. TGHT was stepped up to 60A before starting the auto heating process (See Attachment#1:
TGHT_ramping_up). Note: Although the vacuum is at low e-5 torr, this should be fine to start the TGHT because it takes a while to heat up |
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Wednesday, March 23, 2011, 18:23, John Wong, , , , , Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4)
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March 23, 2011
12:30: Target oven is wrapped with 3 Ta-heat shields. Pumping down evaporator
18:24: IEVAPIG1 is reading at 4.55e-6 Torr. The p/s will be turned on tomorrow since there is no ISAC Ops on site. |
 Friday, March 25, 2011, 17:22, John Wong, , , , , Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4)
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John Wong wrote:
March 23, 2011 |
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Monday, March 28, 2011, 11:20, , , , HP-FEBIAD, Done, Diffusion Bonding of Ta Fins for FEBIAD HP-A (w.o#38481-4)
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John
Wong wrote:
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Monday, December 02, 2013, 16:10, Anders Mjos, , , , Done, Copper bar on TGHT
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The conductivity of the TGHT circuit will be measured with a copper bar shunt.
Monday, December 02, 2013, 16:00: Pumping down.
Tuesday, December 03, 2013, 09:40: Stepped current up to 600A. Impedance of system ~0.7 mOhm. See attached graph for P(I). |
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Monday, September 03, 2012, 02:56, Peter Kunz , UC2, 39165-5, LP-SIS, In progress, Conditioning UCx05
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| Organic/volatile burnoff complete at TGHT = 190A. Rampdown initiated. |
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