Logbooks Lab Maintenance Evaporator_1 Evaporator_2 Laser cutter Target Production Test-Stand RH-ISAC RH-Cyclotron RH-Meson Hall RH-Beamlines RH-ARIEL
  Evaporator_2, Page 15 of 34  Not logged in ELOG logo
    Reply  Tuesday, May 22, 2012, 15:26, John Wong, SiC, 38481-2, HP-SIS, Done, Re-condition the HP-SIS SiC target  


    
        
            Nikita Bernier wrote:
        
        
            
            
            
              
    Reply  Wednesday, May 23, 2012, 17:45, John Wong, BeO, Target boat #2, , Done, Sintering BeO pellets #3 past_5_hrs.JPGpast_21_hrs.pngpower_lost_2012-05-27_12_0630hr.pngTGHT_600A.pngTGHT@600A_past_12hr.JPG


    
        
            Nikita Bernier wrote:
        
        
            
            
            
              
Entry  Monday, May 28, 2012, 11:15, John Wong, , , , Problems, Chiller is leaking water  Chiller_leaky.jpg
Monday, May 28, 2012, 11:08
It was discovered this morning that the Evaporator #2 chiller was leaking water from the bottom (see attachment 1).  A puddle of water was
formed and eventually found its way down to the Hotcell. 
    Reply  Monday, June 11, 2012, 12:26, John Wong, SiC, 38481-2, HP-SIS, Problems, End caps vaporized Photo_2012-06-11_12_06_19_PM.jpg


    
        
            John Wong wrote:
        
        
            
            
            
    Reply  Wednesday, June 20, 2012, 22:33, John Wong, NiO, Ta target boat, , Done, NiO development Photo_2012-06-21_8_27_40_AM.png


    
        
            Nikita Bernier wrote:
        
        
            
            Wednesday, June 20, 2012, 17:23
    Reply  Thursday, June 21, 2012, 18:13, John Wong, NiO, Ta target boat, , Failed, NiO development - Container broke!  NiO_targets_temp.pdfTGHT_0-580A.GIFTGHT_200-580A.GIFTGHT_vs_VOL.GIFNiO_container_broke.png


    
        
            John Wong wrote:
        
        
            
            
            
Entry  Thursday, July 12, 2012, 17:55, John Wong, NiO, targetboat (TaC coated), , Maintenance, NiO development- test#2 NiO_spray.PNGTGHT0-250A.png
Thursday, July 12, 2012, 17:29
NiO was sprayed on Ni foil.
Average/discs: mass= 0.075g, thickness=0.076mm, density = 7.023g/cm3.
Entry  Tuesday, July 17, 2012, 16:00, John Wong, , targetboat (TaC coated), , Done, Sintering TaC coated regular- & D-endcaps 
Tuesday, July 17, 2012, 15:45
Target boat is filled with TaC coated regular- and D-endcaps. 
The boat is wrapped with a Ta heat-shield. 
Entry  Thursday, July 19, 2012, 17:05, John Wong, Empty, 37918-3, LP-FEBIAD, Done, Coating target oven /w TaC & sintering for UCx#5  
Thursday, July 19, 2012, 16:58
The target container was coated with TaC. 
It's wrapped with 3 layers of Ta as the heat-shield, including the backblock.
Entry  Sunday, July 22, 2012, 20:51, John Wong, NiO, 38481-7, HP-FEBIAD, Done, Sintering NiO#1 NiO#1_sinteringevap2.pngNIO#1_TGHT_TBHT_250_220.pngSintered_NiO.GIFEndcap.GIF
 Sunday, July 22, 2012, 20:30
The NiO target materials were loaded into the container today.  
Total discs = 500, (10 discs/pack) 
Entry  Monday, July 30, 2012, 15:42, John Wong, , , , Problems, Chiller maybe leaky chiller.jpg
Monday, July 30, 2012, 15:38
The evaporator was used for the processing the NiO target for 8 days and it was discovered today that there was a puddle of water underneath the
chiller. 
Entry  Tuesday, August 14, 2012, 15:11, John Wong, , , , Maintenance, Replacing Cu-heatshield insulators insulators.PNGMM800_insulator.PNG
Tuesday, August 14, 2012, 15:01
The Cu-heatshield insulators are broken due to prolong heating time during the target processes (see attachment#1). 
The insulators are replaced with the MM800 type (see attachment #2). 
Entry  Tuesday, August 14, 2012, 15:57, John Wong, SiC, 38295-8 , HP-FEBIAD, Done, Testing endcaps inserted /w the new expansion tool vacuum_leaks.PNGTGHT_TBHT.png
Tuesday, August 14, 2012, 15:44
This SiC target was prepared in May 2011 with the Evaporator#1.  The target will not used for online. 
Two endcaps were inserted with the new expansion tool.  The target will be heated up to the normal operating condition (TGHT =580A, TBHT =
    Reply  Tuesday, August 14, 2012, 17:11, John Wong, , , , Failed, Sintering Ta2O5 coating on Ta foil failed Ta2O5_coating.PNG


    
        
            Nikita Bernier wrote:
        
        
            
            
            
Entry  Wednesday, August 22, 2012, 17:36, John Wong, Empty, 39165-5, LP-SIS, Done, Coating target oven /w TaC & sintering for UCx#5 
Wednesday, August 22, 2012, 17:25
Note:  LP-FEBIAD target container ( W.O#37918-3) was coated with TaC and sintered on July 19 for UCx#5 target.  Then, a last minute request
from the Sci Dev. to run the UCx#5 in LP-SIS. 
Entry  Wednesday, October 10, 2012, 16:37, John Wong, Empty, 39165-4, LP-SIS, Done, Coating target oven /w TaC & sintering for TiC#3 striptool_archiver_container_TaC_coating.PNG
Wednesday, October 10, 2012, 16:35
Target container is coated with TaC.  No Ta-heat shields are used.
TGHT will be ramped up to 580A at 0.2A/min.
Entry  Tuesday, October 16, 2012, 14:18, John Wong, TiC, 39165-4, LP-SIS, Done, Sintering TiC#3 TiC#3_maxcurrent.PNG
Tuesday, October 16, 2012, 14:12
Target is filled with 360 discs of TiC (with 1 mole of graphite) backed on C-grv foil.  
No Ta heat-shields wrapped around the container.
Entry  Friday, January 11, 2013, 11:16, John Wong, , , , Maintenance, Replace terminal insulator broke_insulator.PNG
Friday, January 11, 2013, 10:59
The insulator that holds the terminals was broken when a target container was installed.  The insulator had seen so much heat shine from the
Cu heat-shield gaps, see attachment.  Tightening the bolts on the target container might further put more force on the insulator and eventually broke
Entry  Friday, January 11, 2013, 14:00, John Wong, Empty, Ta-Target boat, , Done, Testing QMS & thermocouples evap2_thermocouple_setup.PNGQMS_temperature_setup.PNG008_all_temp.png018.png022.png
 Friday, January 11, 2013, 13:52
TEST#1
A new target boat is coated with TaC and will go through the sintering process at 580A (max).  Ramping rate 5A/20min.
Entry  Tuesday, January 22, 2013, 16:14, John Wong, , , LP-SIS, Done, Heating RFQ components & measuring temperatures 2169.jpgautorampingup_800.PNG
 Tuesday, January 22, 2013, 12:38
This is to test the newly developed RFQ target to be commissioned this year.  The purpose of this test is to see how well the RFQ components
can sustain the high temperature.  One thermocouple is connected inside the target and the other is connect outside of the Cu heat-shield.  RGA
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