ID |
Date |
Author |
Target/No.# |
Source |
Station |
Module |
Target Oven W.O# |
Heat Shield W.O# |
Status |
Subject |
3
|
Tuesday, March 29, 2011, 14:14 |
John Wong | Ta#35 | HP-SIS | ITE | TM4 | 38481-3 | 38303-4 | Spent | ITE-TM4-Ta#35-Hp-SIS |
ITE-TM4-Ta#35-Hp-SIS
Thu Apr 7 15:32:32 2011:
Target oven - w.o#38481-3.
Packs of Ta foils were previously prepared by Vicky H.
Marik loaded the target: 400 of 0.025mm foils (25 foils/pk) in 3.5cm length. (Recommended length 4.0-4.5cm; If too closely packed, wires get squeezed and snapped)
Average mass per discs = 0.105g
Total mass (Ta+wire) = 45.06g
Disc area = 2.12cm2
Ta thickness = 21.25g/cm2
Thu Apr 28 :
Target heat Shield (w.o 38303-4) cleaned
Target is now assembled by John and Rick
Megger Test Performed:
TA-->HS = 540V, OL
TA-->EE = 540V, OL
HS--> EE = 1049V, OL
Leak Check OK
*SIS restraint used in this target ion source
Mon May 9 10:32:40 2011: Standard salts added: Li, Na, Rb @ 10uL, K @ 5uL (but added 10uL), Cs @ 15uL. Target will be going to the test stand.
Fri May 20 16:57:22 2011:
Target was tested on the Test Stand but problems with the software (see Test stand elog).
Standard salts added: Li, Na, Rb @ 10uL, K @ 5uL (but added 10uL), Cs @ 15uL, and Be @ 10uL.
Monday, July 18, 2011, 11:15: Target ended on July 16. The target was used online for an extra 2 weeks and performed very well.
|
Attachment 1: Ta-HPSIS.jpg
|
|
4
|
Thursday, March 31, 2011, 15:38 |
John Wong | SiC#25 | HP-SIS | ITE | TM4 | 38481-1 | 38307-? | Spent | ITE-TM4-SiC#25-Hp-SIS |
Thu Mar 31 15:19:51 2011: SiC#25 was made sometime in December of 2010. It is now in the target module and ready to be conditioned.
Mon Apr 18 18:17:05 2011: It was found later that no salt was added to this target after it came out from the test stand. However, there were enough 40Ca and 39K for tuning (See attachment#1 for the big mass scan). Once the P+ is back, the yields will be measured.
Fri Apr 29 15:30:26 2011: Low 27Al was ionized from the surface for some reason. However, after the green laser was shone into the extraction tube, more 27Al was produced. Then, the laser was turned off, the target continued to surface ionizing 27Al. There could be a blockage from the rhenium (Re) ionizer foil. Jens L. will investigate this further and do a test with the lasers and the rhenium foil.
|
Attachment 1: big_mass_scan.jpg
|
|
12
|
Wednesday, July 06, 2011, 14:32 |
John Wong | Ta#36 | LP-SIS | ITE | TM4 | 38634-2 | 38307-10 | Spent | Target ready, will go online on July 27 |
Ta-LP-SIS (w.o#38634-2)
Target consists of 400 Ta foils, 4.4 cm in length. Total mass + Ta wire = 40.87g.
Thursday, July 07, 2011, 15:43: Begin target assembly.
Friday, July 08, 2011, 14:24: assembly completed. Std stds added for test-stand: Li, Na, Rb, K, Cs.
Friday, July 15, 2011, 09:09: Target currently in test-stand. Will come out on Monday next week. Need to add std salts + Be.
Monday, July 18, 2011, 10:58: Target removed from test-stand. Std salts added (Li, Na, Rb, K, Cs) & Be (as requested by Jens). Maico D.V will do a final inspection on the target before it goes into the hotcell
|
15
|
Friday, September 23, 2011, 17:03 |
Anders Mjos | SiC#26 | HP-FEBIAD | ITE | TM4 | 38295-9 | 38307-8 | Spent | Run finished |
Friday, September 23, 2011, 16:54:
- Cu-gaskets used for leak checking target had a leak rate of about 10-8 10-9 atm cc/sec. Replaced with silver plated SS gaskets and no leak detected above 10-11 atm cc/sec.
- The target can not hold high voltage when it is sitting on the jig. The insulator on the jig have reduced resistance over time (less than 1 G Ohm). All high voltage tests passed when target is tested not sitting on the jig.
- Target is now in the test stand and pumping down.
|
17
|
Monday, October 17, 2011, 14:45 |
John Wong | SiC#26 | HP-FEBIAD | ITE | TM4 | 38295-9 | 38307-8 | Spent | Run finished |
Anders Mjos wrote: |
Friday, September 23, 2011, 16:54:
- Cu-gaskets used for leak checking target had a leak rate of about 10-8 10-9 atm cc/sec. Replaced with silver plated SS gaskets and no leak detected above 10-11 atm cc/sec.
- The target can not hold high voltage when it is sitting on the jig. The insulator on the jig have reduced resistance over time (less than 1 G Ohm). All high voltage tests passed when target is tested not sitting on the jig.
- Target is now in the test stand and pumping down.
|
Monday, October 17, 2011, 14:41
After the test-stand, the extraction electrode showed some electric arcing mark, but no solid deposits were found. (see attachment#1: EE_after_teststand.jpg)
See attachment for the target specification. |
Attachment 1: EE_after_teststand.jpg
|
|
Attachment 2: SiC#26_specification.png
|
|
20
|
Monday, February 20, 2012, 16:39 |
John Wong | UO2/Nb #1 | LP-FEBIAD | ITE | TM4 | 38481-9 | | Spent | target ready for assembly |
Monday, February 20, 2012, 16:25
Mass of empty target oven used = 461.55g
Target oven filled with 402 discs of UO2/Nb, 5.0cm in length, and tot mass (before sintered) was 61.49g (UO2+Nb+org).
Target finished the sintering process on Feb 20, 2011.
U(402 foils) mass = 35.689g
U(402 foils) thickness = 16.834 g/cm2
Target is stored in the Hotlab and ready for assembly.
|
21
|
Thursday, May 24, 2012, 11:04 |
John Wong | SiC#27 | HP-SIS | ITE | TM4 | 38817-3 | 39069-2 | Spent | HP-SIS SiC27 target description |
Thursday, May 24, 2012, 10:34
SiC#27- HPSIS target description:
Total SiC foils = 240 discs
Total SiC+ C-grv = 27.79g
Total length = 8.3cm
Average mass of SiC/disc (without C-grv) = 0.085g
Average thickness of SiC (without C-grv) = 0.24mm
No Rh foil added
Salt added = 10uL Li, 10uL Na
see attachment#1: SiC#27_density measurements
see link for more details: http://documents.triumf.ca/docushare/dsweb/View/Collection-8530
|
Attachment 1: SiC#27_specification.png
|
|
24
|
Wednesday, July 04, 2012, 11:32 |
Anders Mjos | UO2/Nb #1 | LP-FEBIAD | ITE | TM4 | 38481-9 | 39069-3 | Spent | target assembled |
John Wong wrote: |
Monday, February 20, 2012, 16:25
Mass of empty target oven used = 461.55g
Target oven filled with 402 discs of UO2/Nb, 5.0cm in length, and tot mass (before sintered) was 61.49g (UO2+Nb+org).
Target finished the sintering process on Feb 20, 2011.
U(402 foils) mass = 35.689g
U(402 foils) thickness = 16.834 g/cm2
Target is stored in the Hotlab and ready for assembly.
|
Target assembled with new anode end cap.
See attachment for gap size and DocuShare for further information. |
Attachment 1: UO2#3_Anode_End_Cap.xlsx
|
26
|
Wednesday, August 01, 2012, 09:37 |
Pierre Bricault | ITE-TM4-UO#3 | LP-FEBIAD | ITE | TM4 | | | Problems/Solutions | Short has developed while lowering the cathode heater |
On tuesday July we lower the cathode heater to swap the anode-cathode bias. While lowering the cathode heater a short on the anode developed.
The polarity swap was not possible because the target/tube assembly has also a short to common.
We return the configuration has it was and we added two 100 Ohms: 5 W resistor between the common and the heaters to prevent current to flow back to the common.
The anode short disappear during the cathode and target heating. |
27
|
Wednesday, August 29, 2012, 14:52 |
John Wong | UCx#5 | LP-SIS | ITW | TM4 | 39165-5 | | Failed | UCx#5 target description |
Wednesday, August 29, 2012, 14:50
UCx#5 target description, see attachment#1
The target is currently undergoing the final conditioning in the Evaporator #1.
Wednesday, December 05, 2012, 15:46
This target was broken right before the end of the final run. The target was inspected today inside the Hotcell and the pictures can be found here: http://documents.triumf.ca/docushare/dsweb/View/Collection-9357
Looks like the protective layer (TaC coating) was worn out over the course of the run time.
We need to improve the target coating so this can be prevented in the future.
More info about this later...
|
Attachment 1: UCx#5_specifications.PNG
|
|
29
|
Thursday, October 11, 2012, 11:41 |
John Wong | NiO#1 | HP-FEBIAD | ITE | TM4 | 38481-7 | 39069-1/10(lid) | Spent | NiO target description |
(Should have posted this before my long vacation... Anyway, it's for documentation)
Thursday, October 11, 2012, 11:38
NiO/Ni #1 |
Average |
NiO + Ni (g) |
0.109 |
NiO - Ni foil (g) |
0.06 |
NiO + Ni thickness (mm) |
0.116 |
NiO - Ni Thickness (mm) |
0.091 |
Area (cm2) |
2.212 |
NiO + Ni - organics 8.95% (g) |
0.099 |
NiO - Ni - Organics (g) |
0.055 |
NiO Density (g/cm3) |
2.145 (32%) |
Target contains 500 NiO/Ni discs and is measured at 9.0 in length. |
30
|
Tuesday, December 11, 2012, 15:44 |
Anders Mjos | SiC | HP-FEBIAD | ITW | TM4 | na | na (old style fittings) | Ready | Test target for the Conditioning Station |
The target has been used for operator training previously at the ISAC Test Stand.
- 9-pin connector was completed and grounded
- RH gripper arms added to the heat shield
Further documentation on DocuShare |
31
|
Tuesday, March 19, 2013, 13:32 |
John Wong | SiC#28-RFQ | LP-SIS | | TM4 | LP-RFQ (NEW) | | Spent | SiC#28-RFQ target description |
Tuesday, March 19, 2013, 12:28
SiC#28 - RFQ target description:
Total SiC foils = 325 discs
Total SiC + C-grv foils = 38.48 g
Total length = 10.9cm
Average mass of SiC/disc (without graphite foil) = 0.083 g
Average thickness of SiC (without graphite foil) = 0.18 mm
No Rh foil added
See attachment #1: SiC#28 RFQ density measurements
See link for more details: https://documents.triumf.ca/docushare/dsweb/View/Collection-9771
|
Attachment 1: SiC#28_RFQ_density_measurements.xlsx
|
34
|
Wednesday, July 10, 2013, 18:41 |
John Wong | SiC#29 | HP-FEBIAD-CTL | ITE | TM4 | 38481-6 | 39956-4 | Spent | SiC#29 - Target description |
Wednesday, July 10, 2013, 18:32
SiC#29 HP-FEBIAD-CTL target description:
Total SiC foils = 510 discs
Total mass SiC + C_grv foils = 62 g (before sintering, expecting ~13% loss of organic mass after burnt off)
Average mass SiC/disc (without C_grv) = 0.0892 g
Average thickness SiC (without C_grv) = 0.21mm
No Rh foil and salt added for this run.
See attachment #1 for the density measurement.
Wednesday, July 10, 2013, 18:40
Target is currently in the Test-Stand. Once it's tested; it is ready to go online.
Happy Beaming!
|
Attachment 1: SiC#29_density_measurements_final.xlsx
|
37
|
Friday, October 25, 2013, 17:35 |
John Wong | Ta#41 | HP-SIS | ITW | TM4 | 38817-10 | | Spent | Ta#41 target description |
Friday, October 25, 2013, 17:35
Ta#41 HP-SIS target description:
Total Ta foils = 400
Foil Thickness = 0.025mm
Target density = 16.69g/cm3
Target length = 4.0cm
Total Mass (400 foils + Ta wire) = 42.19g
|
38
|
Wednesday, November 27, 2013, 17:56 |
John Wong | UCx#8 | LP-IG-LIS | ITE | TM4 | 39814-IV | | Spent | UCx#8 target description |
Wednesday, November 27, 2013, 17:49
UCx#8 target description - see attachment#1
|
Attachment 1: UCx_8_specification.PNG
|
|
39
|
Monday, March 17, 2014, 16:15 |
John Wong | Ta#42 | LP-SIS | ITW | TM4 | 40282-1 | 39956-1 | Spent | Ta#42 Target description |
Monday, March 17, 2014, 16:14
Ta#42 LP-SIS target description:
Total Ta foils = 400
Foil Thickness = 0.025mm
Target density = 16.69 g/cm3
Target length = 4.2cm
Total Mass (400 foils + Ta wire) = 45.899g
|
44
|
Tuesday, July 15, 2014, 11:01 |
Laura Lambert | UCx # 10 | LP-SIS | ITE | TM4 | 39165-10 | | Ready | UCx#10 Target Description |
Tuesday, July 15, 2014, 10:58
See attachment for target description |
Attachment 1: UCx_10_target_description.PNG
|
|
47
|
Thursday, September 25, 2014, 16:01 |
Laura Lambert | Ta#44 | HP-SIS | ITE | TM4 | 38817-9 | 40316-11 | Ready | Ta#44 target description |
Thursday, September 25, 2014, 15:59
Ta#44 HP-SIS target description:
Total Ta foils = 400
Foil Thickness = 0.025mm
Target density = 16.69 g/cm3
Target length = 4.5cm
Total Mass (400 foils + Ta wire) = 47.49g
|
48
|
Thursday, November 06, 2014, 13:35 |
Laura Lambert | UCx # 11 | LP-SIS | ITE | TM4 | 40282-5 | | Ready | UCx#11 Target Description |
Thursday, November 06, 2014, 13:29
See attachment for target description
|
Attachment 1: UCx_11_target_description.PNG
|
|