TM4 has been connected at CS. CS HV cover is installed.I made a pair of new cooling lines for TM window cooling at CS. The TM4 containment box window cooling line is connected to the HVC spare circuit now. I checked water flow visually, and it is good. The TM4 is ready for conditioning.See attachment for window cooling modification.

PNG1 connected to PNG in service cap (as per David W)

 Wednesday, June 03, 2015, 12:59: Water on

Wednesday, June 03, 2015, 13:04: Staging enabled.

Wednesday, June 03, 2015, 14:02: Auto-ramping to 580 and 200 A at 2 and 1 A/min.

Wednesday, June 03, 2015, 14:03 : BIAS/EL/EE to 20/10/1.5 kV

ISAC operations monitored TCS from Wednesday to Monday

Monday, June 08, 2015, 08:55 : Started cool-down of target

Monday, June 08, 2015, 09:19: BIAS/EL/EE off

Monday, June 08, 2015, 09:32: EE configured to conditioning mode

Monday, June 08, 2015, 10:12 : TGHT and TBHT off

Monday, June 08, 2015, 10:25: BIAS/EL to 20/10 kV

Monday, June 08, 2015, 10:32: BIAS/EL to 30/15 kV

Monday, June 08, 2015, 10:45: BIAS/EL to 40/20 kV. Some bias sparking from ~39 kV

Monday, June 08, 2015, 13:40: BIAS/EL to 47.5/20 kV

Monday, June 08, 2015, 14:35: BIAS/EL to 50/20 kV

Monday, June 08, 2015, 14:39: BIAS/EL to 50/25 kV

Monday, June 08, 2015, 16:54: BIAS/EL to 53/25 kV

Monday, June 08, 2015, 17:03: BIAS/EL/EE off

Tuesday, June 09, 2015, 08:02: BIAS/EL to 30/15 kV

Tuesday, June 09, 2015, 08:07: BIAS/EL to 40/20 kV.

Tuesday, June 09, 2015, 08:13: BIAS/EL to 50/25 kV

Tuesday, June 09, 2015, 08:27: BIAS/EL to 53/25 kV 

Tuesday, June 09, 2015, 08:57: BIAS/EL to 55/25 kV  

Tuesday, June 09, 2015, 09:31: Power supplies tripped on IG2 vacuum after a spark at ~57.5 kV

Tuesday, June 09, 2015, 09:40: BIAS/EL to 40/20 kV.

Tuesday, June 09, 2015, 10:00 : BIAS/EL to 55/25 kV  

Tuesday, June 09, 2015, 10:09: BIAS/EL to 57.5/25 kV

Tuesday, June 09, 2015, 10:22: Sparking activity at 58 kV. Tripped TP2 and BV2. Reduced to 50 kV. Leakage current increased.

Tuesday, June 09, 2015, 10:33: Sparking activity at 55 kV. Reduce to 45 kV. Increased BIAS current limit from 0.25 to 0.30 mA

Tuesday, June 09, 2015, 10:41: BIAS/EL to 50/25 kV. BIAS RDCUR 0.17 mA, was 0.08 mA at 8:13 this morning.

Tuesday, June 09, 2015, 11:28 : Restarted TP2. Tripped.

Tuesday, June 09, 2015, 11:50:  Increased BIAS current limit from 0.30 to 0.35 mA

Tuesday, June 09, 2015, 11:55 : BIAS/EL to 54.5/25 kV for 5 min, 0.12 mA . Reducing to 40 kV for lunch break.

Tuesday, June 09, 2015, 13:07: BIAS/EL to 50/25 kV 

Tuesday, June 09, 2015, 13:27: BIAS/EL to 55/25 kV 

Tuesday, June 09, 2015, 13:40: BIAS/EL to 57/25 kV 

Tuesday, June 09, 2015, 13:49: BIAS/EL to 57.5/25 kV. Increased BIAS current limit from 0.35 to 0.40 mA

Tuesday, June 09, 2015, 14:30: IG1 tripped after spark. Controller seems to be broken. Forced IG1. Fault report submitted June 10th.

Tuesday, June 09, 2015, 14:58: BIAS/EL to 45/25 kV

Tuesday, June 09, 2015, 15:46: BIAS/EL to 55/25 kV

Tuesday, June 09, 2015, 15:55: BIAS/EL to 56/25 kV

Tuesday, June 09, 2015, 17:30: BIAS/EL to 57/25 kV 

Tuesday, June 09, 2015, 17:46: BIAS/EL to 57.5/25 kV 

Tuesday, June 09, 2015, 18:00: BIAS/EL to 58/25 kV

Tuesday, June 09, 2015, 18:30: No sparks for 30 min

Tuesday, June 09, 2015, 18:55: One spark observed. BIAS/EL off.

Tuesday, June 09, 2015, 18:56: Turbos stopped. Stopped water circuit.

Thursday, June 11, 2015: IG1 seems to work again after a power cycle. Controller tested with another IG. Closing Fault report

I revised the Target Hall schedule to July 21 2015. It is the time new TM2 with ZrC target started at ITW.

2015-06-04, Updated the schedule with   new PDF view. See attachments 3, 4

TM4 and CS turbo-pumps are started this afternoon. Everything is good so far.

 TM4 IG1 filament was broken during last run  at ITE.  The broken filament is replaced with a new one today when TM4 is located at CS.

2015-06-03 , Leak checked the new 25 conflat gasket today. No leak. See attachments

Chad and I leak checked TM4 HS water line with SiC #31 target installed. leak rate:0.0xE-9atm.cc/sec.  No leak.  The line will be helium pressurized at CS later.

2015-06-03, helium pressure test the line at CS. 70psi 3 minutes. leak rate 0.0xE-9 atm.cc/sec. No leak.   See attachments

TM#4 with SiC#31 has been moved from the south hot cell to the conditioning station.

Electrical check on TM#4 with SiC#31. See attached PDF for details.

Ta #45 has been removed from TM4 and SIC#31installed.

Target Hall schedule weekly update. All jobs are finished on time so far.

Post beam electrical check on the Ta#45 target installed on TM#4. See attached PDF.

TM#4 with Ta#45 has been moved from the east target station to the south hot cell.

TM#2 with no source tray has been moved from the conditioning station to the north east silo.

TM#2 with no source tray has been moved from the south hot cell to the conditioning station.

The shutter in TM2 was successfully replaced today.

New lock washer and nut were installed onto shutter and nut torqued to 120 ft lbs.

Shutter guide alignment tool was used to insure tapped shutter guide holes were concentric with thru holes in shutter side mounting panel, button head screws replaced and torqued to 110 ft-lbs.

The shutter was manually cycled open and closed by David and everything is to operate well.

Hello,

For reference, I have attached a list of all solder joints in the TM2 Source Tray, and the alloys used for the most recent build (as per ITA6144).   I have also provided data sheets for the alloys, and PDF copies of all the drawings calling out the joints.

Certanium 34 C (222 deg C melt point) was used for all low-temperature solder applications, except for the steel inserts in the water blocks.  Previous revisions of the Source Tray drawings called out a higher-temperature McMaster lead-based solder (304 deg C melt point).  The change to Certanium 34 C on the prints was made in Bevan's era, during the transitional update of the source tray drawings between the TM1 and TM3 source tray projects, just before I took over updating the drawing packages.  I believe Bevan made this change on general advice from Guy Stanford, who stated that Certanium 34 C is a much easier solder to work with and makes a more mechanically reliable joint.  However, the change really should have had more review and validation testing before being implemented.

This said, we now have a source tray that uses Certanium 34 C, and rework of every joint would set us back too far in the schedule to meet the deadline, so we will have to run with it as it is.

Of particular concern are the joints on the target oven and coil heating blocks, which are now using a lower temperature solder (222 deg C melt vs 304 deg C melt).  We have experienced a coil block failure on TM4 due to a failed solder joint, although the failure mode is not known for certain.  We also had two recent failures on the test stand of a coil joint soldered with Certanium 34 C, but this was due to an error in the connection of cooling water to the joints (i.e. the joints had no coolant flow and the solder melted... this is expected!).

Anders and I have performed independent thermal analysis on the joints due to the radiative and electric heating from the target, and have concluded that even with a lower temperature solder, there is a lot of margin, so the risk seems to be low.  This work will be published in a separate report to be circulated later.

Thank you and regards,

Grant

5 shielding blocks have been transferred from ITE to ITW. I  checked all ITW water signals, and they are good.  ITW is configured to take proton beam.

TM2 has been successfully de-shuttered.

All went pretty much according to plan except I had to remove one fastener out of the upper wiring harness (the one that has just been installed) to allow for enough clearance to rotated the shutter guide out of the way...I shutter to think what would have happened otherwise...anyways...

Close inspection of the shutter does show that the "thin" area isn't in very good shape; whether this is a result of removal or just the way it was is hard.Due to the ease of removal I would quess that it may have been a preexisting condition. That being said...I think we may want to consider replacing it.

The schedule has some changes due to  new TM2 source tray coil cooling line leaking at test stand. Now,It is re-scheduled in such an estimation  that TM2 source tray could be ready at teat stand by this Friday(May-15th). see attachment 1,2.

2015-05-12,  Changed  and updated the TH activity schedule according to Dons new beam schedule which is re-arranged after the coil line leaking issue. See attachments 3,4. No major conflicts has been found on the new schedule.

2015-05 25, Updated the TH activity schedule according to present TM2 job processing. See attachment 5,6.

 The communications chip has been replaced. The electronics box has been grounded (see attached pdf).