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Message ID: 98     Entry time: Thursday, May 17, 2012, 13:24
Author: John Wong 
Target/No.#: SiC#27 
Source: HP-SIS 
Station: ITE 
Module: TM4 
Target Oven W.O#: 38817-3 
Heat Shield W.O#:  
Status: Problems/Solutions 
Subject: Solid residues found on EE 

 Thursday, May 17, 2012, 13:15

After the test-stand, the EE was removed for inspection.  It was discovered that there were some solid residues coated on the extraction electrode and the common plate, but the ionizer tube was clean (see attachment#1).  Some samples were collected and will try to do some analysis.  This problem has been seen before but it's still not clear why the solid residues form after the test-stand.  

The EE & the common plate were cleaned with acetone and re-assembled back to the target.  


 

Attachment 1: SiC#27_after_teststand.pdf  1.356 MB  | Show | Hide all
Attachment 2: SiC#27_clean_EE.pdf  1.051 MB  | Hide | Hide all
SiC#27_clean_EE.pdf
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