TCS was argon vented this morning between 7:00 to 8:30 am before module was moved to ITE.

TCS was argon vented this morning between 6:00 and 7:30am for TM4 moving to ITW.

TM2 was moved from silo to TCS yesterday morning. The move is smooth.    TCS vacuum system was started after. TCS and TM2 pumping down is ok so far.

refilled TCS:TK2 to 27.4 inches to compensate water lost during THC filters change.

TCS water system  five filters were changed yesterday by plant group Dan.T. Service labels on filters are updated.  No water leak after job.

TM2 is moved from TCS to silo this morning. The move is smooth.

  couple of E-8 to low E-7 atm.cc/sec leak were found on TM2 service cap top air to vacuum  o rings.  Replaced these leak o ring seals including o ring on IG1 and steerer service panel,o rings on MSP, EE, D blue nylon and copper feed through, and o ring on a round blank off beside MSP terminal on second row. 

2024-july-03 update: TM2 was leak checked again at TCS. no air to vacuum leak on module top. i helium pressure tested(60psi) all water cooling lines (except HS) . They are leak free.

Tm2 has been successfully moved from SW silo to TCS.

Tm2 has been moved from TCS to SW silo. the move is smooth.

TM4 has been moved from SHC to TCS. The move is successfully.

TM4 has been moved from SHC to TCS. The move is successful.

TM4 has been moved from SHC to TCS. The move is smooth.

TCS water system resistivity analyzer has been repaired. Two diodes and one capacitor on PS board were broken. They were replaced. Installed analyzer back and tested it in system. it works fine. Operator closed e-fault, removed force on TS5, and enabled alarm on TS5 and TC1.

TCS water system has been started for functional test. System parameters including  pressure, all temperature sensors, flow rate sensors, resistivity are ok. I will watch on chiller CP1/2/3 in rest of the week and make sure chiller CP1/2/ 3 auto stage in/out work fine.

TM3 was moved from SHC to TCS with UCx#47. The move was smooth.

A complete TM3 electrical check at TCS under good vacuum has been done. Pin 14 to 60KV only has 8K ohm on ohmmeter check , and it's about 2Kohm @250V Megga. It's low in resistivity. The pin 14 is for thermocouples only so no big concern.  The rest things are good. See attachments.

Tm3 has been moved  from TCS to silo. The move is successful.

Hello,

For reference, I have attached a list of all solder joints in the TM2 Source Tray, and the alloys used for the most recent build (as per ITA6144).   I have also provided data sheets for the alloys, and PDF copies of all the drawings calling out the joints.

Certanium 34 C (222 deg C melt point) was used for all low-temperature solder applications, except for the steel inserts in the water blocks.  Previous revisions of the Source Tray drawings called out a higher-temperature McMaster lead-based solder (304 deg C melt point).  The change to Certanium 34 C on the prints was made in Bevan's era, during the transitional update of the source tray drawings between the TM1 and TM3 source tray projects, just before I took over updating the drawing packages.  I believe Bevan made this change on general advice from Guy Stanford, who stated that Certanium 34 C is a much easier solder to work with and makes a more mechanically reliable joint.  However, the change really should have had more review and validation testing before being implemented.

This said, we now have a source tray that uses Certanium 34 C, and rework of every joint would set us back too far in the schedule to meet the deadline, so we will have to run with it as it is.

Of particular concern are the joints on the target oven and coil heating blocks, which are now using a lower temperature solder (222 deg C melt vs 304 deg C melt).  We have experienced a coil block failure on TM4 due to a failed solder joint, although the failure mode is not known for certain.  We also had two recent failures on the test stand of a coil joint soldered with Certanium 34 C, but this was due to an error in the connection of cooling water to the joints (i.e. the joints had no coolant flow and the solder melted... this is expected!).

Anders and I have performed independent thermal analysis on the joints due to the radiative and electric heating from the target, and have concluded that even with a lower temperature solder, there is a lot of margin, so the risk seems to be low.  This work will be published in a separate report to be circulated later.

Thank you and regards,

Grant

Once the test stand was vented and all lines purged Anders Mjos and myself jigged up the water blocks and proceeded to remove the TM4 SiC#31 target used during the testing, Einso lens and steerer.  Once these components where removed we transferred the source tray to the transport plate and moved it to the alignment area.

Source tray for TM2 has been moved to the alignment area by Dan and co.

This morning Dan removed the c-seals used during the test and he and I inspected the sealing surfaces to determine if they need to be cleaned...they do..trace indium was present on all blocks.

Surfaces will be cleaned before final alignment check.