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Message ID: 944     Entry time: Friday, June 12, 2015, 07:49
Author: chad fisher 
Category: Assembly/Bench Test 
Type: Repair 
Module: TM2 
Target/Number:  
Subject: New TM2 Source Tray Ground to HV Measurements 

After bending and leak checking the new measurements from ground to HV on the TM2 source tray are:

Ground to C1+ 0.6645"

ground to heat shield 0.506

Window to mounting support plate - unchanged - over 0.80"

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