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Message ID: 19     Entry time: Tuesday, May 10, 2011, 14:58
Author: John Wong 
Target Material: Empty 
Target Oven W.O#: 38817-2 
Source: HP-SIS 
Status: Done 
Subject: Diffusion bonding of Ta Fins for HP-SIS (w.o#38817-2)  

Tue May 10 14:56:05 2011:  Target is wrapped with 3 heat-shields.  The evaporator is pumping down, vac @ 4.72e-6 Torr.  TGHT was raised to 60A/0.239V.  Auto heating will being now; THGT will be ramped up to 820A @ 2A/min. (See Attachment#1: Staring_process)

Wed May 11 10:16:03 2011: Auto cooling was started by ISAC Ops' help.  TGHT has ramped down to zero.  The p/s will be turned off and the evaporator will be vented soon. (See Attachment#2: Overall Process).

 

Attachment 1: starting_process.jpg  195 kB  | Hide | Hide all
starting_process.jpg
Attachment 2: overall_process.gif  14 kB  Uploaded Wednesday, May 11, 2011, 11:17  | Show | Hide all
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