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Message ID: 18     Entry time: Monday, May 09, 2011, 16:10
Author: John Wong 
Target Material: Empty 
Target Oven W.O#: 38817-1 
Source: HP-SIS 
Status: Done 
Subject: Diffusion bonding of Ta Fins 

Mon May 9 16:09:35 2011:  Target is wrapped with 3 Ta heatshields and the evaporator is begin pumped down.

Mon May 9 17:59:57 2011:  Vac is @ 1.33e-5 Torr.  TGHT was stepped up to 60A before starting the auto heating process (See Attachment#1: TGHT_ramping_up).   Note: Although the vacuum is at low e-5 torr, this should be fine to start the TGHT because it takes a while to heat up the high power target.

Tue May 10 11:10:44 2011:  TGHT reached to 820A and stayed for 4 hrs before ISAC Ops helped to begin the cooling process.  (See Attachment#2: Overall process).

Attachment 1: TGHT_ramping_up.gif  80 kB  Uploaded Monday, May 09, 2011, 19:03  | Show | Show all
Attachment 2: overall_process.jpg  165 kB  Uploaded Tuesday, May 10, 2011, 12:12  | Show | Show all
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