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Message ID: 11     Entry time: Tuesday, April 12, 2011, 10:30
Author: John Wong 
Target Material: Empty 
Target Oven W.O#: 38481-5 
Source: HP-FEBIAD 
Status: Done 
Subject: Fins diffusion bonding  

Tue Apr 12 10:29:38 2011:  Target wrapped with 3 Ta-heat shields.  Evaporator is currently being pumped down.

Tue Apr 12 15:03:55 2011:  Evaporator has been pumped down for over 4 hrs.  Set TGHT @ 20A/ 0.066V, Vac @ 2.46e-6 Torr. (See Attachment#1 pumping down process).

Tue Apr 12 15:05:11 2011: TGHT @ 40A/0.142V, VAc @ 2.46e-6 Torr. 

Tue Apr 12 15:14:16 2011  Auto heating process begins (See attachment #2 for the parameter setup).  TGHT will reach to 820A max at around 21:45 and the current will stay there for at least 4 hours.  Instructions have given to ISAC Ops to being the auto-cooling down process tomorrow at 03:00 

Wed Apr 13 10:00:13 2011:  TGHT reached to 820A max and stayed for about 5 hrs before the cooling process begun (see Attachment#2: Cooling down process). 

Wed Apr 13 10:04:19 2011: p/s is now off and evaporator is now vented. 

 

 

 

 

 

Attachment 1: grab.s31535.png  27 kB  Uploaded Tuesday, April 12, 2011, 16:13  | Show | Show all
Attachment 2: grab.c31573.png  22 kB  Uploaded Tuesday, April 12, 2011, 16:14  | Show | Show all
Attachment 3: cooling_down.jpg  161 kB  Uploaded Wednesday, April 13, 2011, 11:01  | Show | Show all
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